POWER ON…
PROLOGUE
The Wafer
ZERLON SEMICONDUCTOR CAREER ACCELERATOR PROGRAM · Z-SCAP

One chip. Three years. One engineer.

The chip floating behind this page is you. Scroll — and watch yourself get fabricated, layer by layer, from 2nd-year student to placed semiconductor engineer.

3 YEAR PROGRAM 7 CERTIFICATIONS RTL → TAPEOUT 100% PLACEMENT SUPPORT
Scroll to fabricate
ACT I · SECOND YEAR

Raw silicon holds every possibility.

Your 2nd year deposits the first layer: three awareness workshops, four 15-day FCEP levels and a 30-day Foundation Program — fundamentals before anyone else has started.

Industry & CareersDigital ElectronicsVLSI & Design FlowCMOSRTL with Verilog
Layer 01 · Foundation Building

Before your batch knows what "fabless" means, you'll have written Verilog.

Every card below is deposited onto your substrate during 2nd year.

Workshop 1 · 3 Days

Semiconductor Industry & Careers

Global ecosystem, India's Semiconductor Mission, chip design lifecycle, fabless / foundry / OSAT — every career door VLSI opens.

Workshop 2 · 3 Days

Digital Electronics Fundamentals

Boolean algebra, gates, flip-flops, FSMs, timing — with hands-on logic design lab and simulation demos.

Workshop 3 · 3 Days

Intro to VLSI & Design Flow

CMOS technology, RTL, verification, PD, DFT — capped with a full RTL-to-GDSII flow demo.

FCEP L1–L2 · 15 Days each

Digital Electronics → CMOS

Logic design and K-maps through MOSFETs, fabrication and standard cell libraries.

K-MapsFSMMOSFETStd Cells
FCEP L3–L4 · 15 Days each

RTL with Verilog → Design Flow

Verilog HDL, testbench basics and mini RTL projects — then the complete RTL-to-GDSII picture with FPGA demo.

VerilogTestbenchRTL→GDSIIFPGA
Foundation · 30 Days

Semiconductor Foundation Program

Advanced digital, CMOS, RTL & Verilog, Linux, intro to SystemVerilog & UVM, industry standards, mini project.

LinuxSV IntroUVM IntroMini Project
Layer 1 deposited — deliverables: Semiconductor Awareness Certificate · Digital Electronics Assessment · RTL Mini Project · Future Chip Engineers Certificate
ACT II · THIRD YEAR

LOGIC FORMS

Ten modules etch a complete VLSI engineer into the die.

Layer 02 · Front-End Engineering

10 modules. 1 complete VLSI engineer.

The exact front-end stack semiconductor companies interview on — plus mini projects: UART · FIFO · SPI · APB · AXI Lite · GPIO.

MOD 01
01

Advanced Digital Design

FSM, pipelining, memory design, bus architectures, low power.

MOD 02
02

RTL Design

RTL architecture, coding guidelines, parameterized RTL, arithmetic.

MOD 03
03

Verilog HDL

Advanced RTL, simulation, debugging, testbench development.

MOD 04
04

SystemVerilog

Interfaces, packages, assertions, functional coverage, OOP.

MOD 05
05

UVM

Components, factory, config DB, driver, monitor, scoreboard.

MOD 06
06

Linux

Commands, shell scripting, development environment setup.

MOD 07
07

TCL Programming

TCL syntax, tool automation, scripting for EDA tools.

MOD 08
08

Python for Engineers

Automation, file parsing, report generation.

MOD 09
09

Static Timing Analysis

Timing paths, constraints, setup & hold, timing reports.

MOD 10
10

Clock Domain Crossing

Synchronizers, FIFO-based CDC, CDC verification.

Layer 2 Etched — Deliverables

RTL Design Project · Verification Project · UVM Environment · Timing Analysis Assignment · Technical Assessment

3RD YEAR OUTPUT
ACT III · FINAL YEAR

ROUTE TO TAPEOUT

DV · PD · DFT. Real projects on RISC-V, Automotive and AI Accelerator IPs — then the 16-step flow every chip must survive.

Specification → Tape-Out

Scroll to run the full flow.

01Specification
02Architecture
03RTL Design
04Simulation
05Functional Verif
06Lint & CDC
07Synthesis
08STA
09Floorplan
10Power Plan
11Placement
12CTS
13Routing
14Physical Verify
15Sign-Off
16TAPE-OUT 🎉
TAPE-OUT ACHIEVED

DV: SystemVerilog · UVM · AXI/AHB/APB  |  PD: Floorplan → Sign-off  |  DFT: ATPG · MBIST · LBIST
Real projects: RISC-V · Automotive IP · AI Accelerator RTL — plus internship with Zerlon Semi & partners.

Metallization

Seven certification layers, deposited one over another.

Each credential stacks on the last — ending in gold.

1

Certified Semiconductor Explorer

2nd Year · Where it begins
2

Future Chip Engineer

2nd Year
3

Certified Semiconductor Foundation Engineer

2nd Year
4

Certified RTL Design Engineer

3rd Year
5

Certified Design Verification Engineer

3rd Year
6

Certified Physical Design Engineer

Final Year
7

Industry Ready Semiconductor Engineer

Final Year · Top metal — the gold layer
// FIRST POWER-ON … VOLTAGE STABLE … CHIP ALIVE

PLACED.

The silicon works. The engineer works. The chip behind you just powered on — and so did your career.

3Years
7Certifications
16Flow Steps
100%Placement Support

Placement Accelerator: Resume Development · LinkedIn Optimization · Aptitude Training · Technical + HR Interview Prep · Weekly Mock Interviews · Industry Expert Sessions · Opportunities via the Zerlon Network

Your fabrication starts now

Enter the Z-SCAP pipeline.

Students from ECE, EEE, E&I, CSE, IT, AI&DS, Robotics, Mechatronics & allied branches — plus faculty and TPOs building a Semiconductor Centre of Excellence at their institution.

📗 Z-SCAP Brochure PDF🗺 3-Year Roadmap 🎓 Certification Pathway🏫 College CoE Deck 💬 Free Counselling Call

📋 Register for Z-SCAP

60 seconds · No obligation · Callback within 24 hours

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India's leading VLSI training institute. 9+ years of excellence, 93% placement rate and 2,000+ engineers trained in Physical Design, DV, DFT and Electronics.

9+Years
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